F&K Delvotec
Wirebonding & Laserbonding
Dr. Farhad Farassat and Said Kazemi took over the company as part of a management buy-out from Black and Decker in 1992. Since then a worldwide service network has been created, including subsidiaries in the USA, Singapore and China.
F&K Delvotec has typically been the driving force in the semiconductor industry with many innovative designs being implemented from close partnership with accademic research institutes. This has lead to over 40 innovative Patents being granted during this time.
The recent development of a Laserbonder, specifically for bonding higher gauge materials, specifically Battery Packs & Busbars underlines F&K Delvotec’s dominance in the market.
Recently, F&K Delvotec have been acquired by Strama-MPS, an automation solutions company, specialising in assembly and testing rigs across the electrical engineering, medical device, oil & automotive industries.
MicroAssembly Technologies
Die Bonding
MAT is a Die Attach and Dispensing equipment manufacturer specialising in providing machines and turn-key solutions for most advanced die attach and dispensing applications
Should your application be Eutectic or Adhesive based, Flip Chip or Face Up, MCM, Die Stacking, MEMS, Imaging Device or other, our machines will handle it with high accuracy and yield.