Battery Bonding Specialists

F&K Delvotec offer 2 types of interconnection technology:
Wirebonding – Ultrasonic & thermo-compression bonding
Laserbonding – Wirebonding using a Laser source to replace the Ultrasonics

Ultrasonic Bonding is tried and tested but has its limitations, when bonding higher gauge materials >600micron. This is because you simply cannot transfer enough energy into the 2 materials to be friction welded, using ultrasonic methods.

Laserbonding has certain advantages over traditional Ultrasonic methods:

  • Little of no fixturing required
  • Higher gauge material

Laserbonding also has advantages over traditional Laser welding techniques:

  • Zero Gap technology
  • Higher Yield
  • Greater flexibility

Laser Bonder


Laserbonder – the World’s first Laser Wirebonder

A unique and ground-breaking Laserwelding technology from F&K Delvotec. Revolutionising and re-thinking the way in which we make interconnects. Combining the World or Ultrasonic wirebonding and Laserwelding –> Laser bonding!

This completely new process, based on laser micro-welding. It is particularly suitable for joining wire onto battery terminals and onto DCB substrates and Copper terminals in power electronics modules. Ultrasonic Laser bonding enables the use of higher gauge ribbon bonding for much higher current capacity processes.

In power electronics the physiscal current carrying capacity limit using wire bonding is already pushing the envelope of what is possible. With laser welding, connections of virtually any thickness can be joined but it is currently less flexible due to the requirement for pre-manufactured connectors.

Operating closely with the Fraunhofer-Institut für Lasertechnik (ILT) and S&K Systemtechnik, within the framework of the joint project RoBE (Robustness for Bonds in E-vehicles), supported by the federal ministry for education and research (BMBF), F&K Delvotec developed a technology that combines the best of both Worlds.

Laser bonding offers higher gauge Aluminium and Copper Ribbon to be bonded onto DCB substrates and copper terminals, it is also more robust than conventional wire bonding.
This allows secure and flexible connections of the terminals in battery manufacture and make the handling of connector strips superfluous.


  • New possibilities for precise and reproducible joining of Copper or Aluminium Ribbon.
  • Processing connectors and bonding wires with a diameter >500µm
  • A robust process enables simple and cost-efficient electronic manufacturing
  • Lower demands on surface quality, cleaning processes and rigidity of work pieces compared to wire bonding
  • Bonding onto new surfaces and with new materials

If you are Bonding Batteries, you should be Laserbonding!
#Laserbonding #Laserwelding #Batterybonding #BatteryPacks

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