Model 6400
Model 6410
Highly Accurate Die Attach System
Flexible, fully automatic die attach system
- Available either installed on its own bench or as "Table-Top"
- Capable of cold and hot processes for MCM, Flip Chip, Eutectic, and Ultrasonic assemblies
- Very high placement accuracy of 3 microns @3 sigma
- Handles active and passive components from 0.2 mm upto 25 mm
- Pick from up to thirty 2" or up to nine 4" Waffle or Gel Pak carriers
- Pick from Wafers upto 300mm
- Pick from upto 12 Tape & Reel feeders
- Unusual die sizes and aspect ratios
- Volumetric or time-pressure dispenser applies adhesive in programmable shapes
- Stamping applies adhesive dots as small as 75 microns
- Full Flip Chip capability including chip flipping, bump fluxing and chip final alignment via look-up camera
- Handles CCD (sensors), LCD's, MEMS and other sensitive devices
- Unique die stacking capability with programmable Bond Line Thickness (BLT)
For Dispensing & Stamping
Designed for high flexibility, programming and operation
- Fast and easy setup
- Very large Work area (20" x 12") allows handling large PC boards
- Dispensing and Stamping of different adhesives, flux and other materials
- Cold and Heated substrate holders handling a wide variety of substrates including PCB's
- Silicon Wafers, Ceramic Substrates, Carriers with Single Packages
- Very High Accuracy
- High resolution Digital Vision and Image Processing
- Underfill dispensing process for Flip Chip applications
Specifications:
- Dual Magnification camera for Substrate alignment with 20 mm travel and Auto Focus
- Stamping of less than 75 µm diameter adhesive dots
- Dot size range from: 0.1 mm
- Placement Accuracy: 10 μm @ 3 sigma
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Throughput - up to 3,600 dots/hour