F&K Physiktechnik develops and manufactures products and processes for chip interconnection
Part of the F&K Delvotec Group, the company is mainly focused on ultrasonic technology.
Ultrasonic generators and ultrasonic transducers for wire and (flip chip) die bonding are part of the product range, as well as test and measurement equipment to characterise and set up ultrasonic systems of bond machines.
In order to set up the ultrasonic system of a bond machine in best condition, special test and measurement has been developed. This equipment can not only be used for service purposes, but also for quality assurance.
All information about the condition of the ultrasonic system of the bond machine can be fed into a quality management system.
By using the test and measurement equipment preventive maintenance is also possible.
- Digital Generators
- Mechanical Measurement
- Electrical Monitoring
- Bond Force Calibration